TEConcept GmbH, IO-Link Stack and Development tools

Our company is distributing and supporting IO-Link products of TEConcept GmbH as follows. Link to TEConcept's web page

■ Products we distribute and support  

  • IO-Link Diagnosis Tool (Protocol Analyzer)
  • IO-Link Device TesterIO-Link Device Tester
  • IO-Link Master Tester
  • Physical Layer Tester
  • EMC Test Master/Device
  • USB 1-Port/4-Port Master
  • IO-Link Master Software Stack
  • IO-Link Device Software Stack
  • IODD Designer

IO-Link Diagnosis Tool (Protocol Analyzer)

The Diagnosis tool is an IO-Link analyzer that examines the IO-Link signal both electrically and logically. The acquired data is transmitted via USB to a supplied Diagnosis Tool PC software and evaluated. The IO-Link communication can be analyzed on byte-level, on M-sequence level, on protocol level and even on application level. The IO-Link communication is in the latter case visible in clear text. Folding, filtering and search functions simplify issue identification.

link to TEConcept's web page

IO-Link Master/Device Tester

Every manufacturer of an IO-Link compliant device needs to issue a manufacturer declaration of compliance. This requires that numerous tests that are defined in the IO-Link test specification need to be executed. This device tester simplifies the execution of many of these tests in particular protocol compliance tests.

link to TEConcept's web page

IO-Link Physical Layer Tester

TEConcept has developed a Physical Layer Tester “PLT” for Devices for execution of the Physical Layer Tests according to the IO-Link Test Specification(Latest Version V1.1.2). The Physical Layer Tester is powered by an external 48V power supply, it is controlled via an USB port and it offers a standard M12 connector to connect the Devices under test "DUT". A PC-software tool asks for the IODD of the DUT and automatically adjusts most of its test procedures parameters according to the capabilities of the DUT. The test cases are defined by an XML-files that are accessible by the user.

link to TEConcept's web page

EMC Test Master/Device

The IO-Link specification defines well defined procedures to test the EMC robustness of IO-Link devices. Some tests are checking the sensitivity of the IO-Link communication of IO-Link devices under EMC condit ions. This requires an robust master that is much less sensitive to EMC noise than the device under test.

link to TEConcept GmbH's web site

USB based IO-Link Master

The 1-Port USB Master and 4-Port USB Master are ideally suited for engineering purposes and small PC-based applications. It uses the STMicroelectronics L6360 transceiver chip. A Windows based graphical user interface is included that reads IO-Link device descriptor files and offers an easy way to connect to all kinds of IO-Link devices.

■ 1-Port USB Master Features

  • Fully IO-Link V1.1.2 compliant
  • All COM-speeds supported
  • Data storage supported
  • M12 IO-Link connector
  • DIN rail mount
  • PC-Tool included with Windows DLL available for customized and software based access to the Master
4-Port USB Master Features
  • Fully compliant to IO-Link V1.1.2
  • Data storage supported
  • M12 IO-Link connector
  • DIN Rail Mount
  • PC-Tool included with
  • Option: Windows DLL for customized and software based access to the Master

link to TEConcept GmbH's web site

IO-Link Master Software Stack

The IO-Link master firmware library provides full access to all features and services defined in the IO-Link Communication Specification V1.1. The stack supports all the important features like ISDU, Interleaved Mode and diagnostics handling with event details. A RTOS is required for multiport applications. Several Real Time Operating Systems are supported.

■ Master Stack Features

  • Complies to latest IO-Link communication specification
  • Multi-port support. The number of ports only limited by hardware resources.
  • Cycle times: 0,4ms @ 230,4 kBaud
  • 2,3ms @ 38,4kBaud
  • 18ms@ 4,8kBaud
  • System load max. 20MHz/Port (COM3-speed)
  • Software interface via shared parameters
  • Control and test API
  • Currently available drivers:

■ Processors supported by Master Stack:

  • STMicroelectornics STM32 series (Cortex M0, Cortex M3, Cortex M4)
  • Atmel ATSAM3S (Cortex M3)
  • NXP LPC series (Cortex M0, Cortex M3, Cortex M4)
  • Freescale KL series (Cortex M0+)

link to TEConcept GmbH's web site

IO-Link Device Software Stack

Our IO-Link software stack opens sensor and actuator manufacturers a cost efficient and easy way to integrate state-of-the-art IO-Link technology into their products.

■ Device Stack specifications

  • Compliant to latest IO-Link communication specification
  • Synchronous or asynchronous process data handling
  • ISDU support
  • Data storage
  • Parameter handler.
  • Process synchronization
  • System load ~ 50 % on 8-Bit processor @ 16 MHz
  • Porting to different µCs and IO-Link PHYs requires only an exchange of drivers
  • Matches to the current V1.1.2 IO-Link interface specification
  • Allows synchronous and asynchronous process data access
  • Support of data management
  • Optimized for short response times
  • System load ~ 50 % with a 8-Bit processor @ 14.7456 MHz
  • Modular stack design allows support and exchange of various IO-Link transceiver chips

■ Processors supported by Device Stack:

  • Renesas RL78
  • STMicroelectornics STM32 series (Cortex M0, Cortex M3, Cortex M4), STM8L/STM8S
  • Silicon Labs C8051F31x
  • NXP LPC11xx(Cortex M0)
  • Atmel ATSAM3S (Cortex M3), ATmega32/64/128, ATtiny
  • MSP430
  • EFM32
  • Kinetis KL series

link to TEConcept GmbH's web site